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Microscope Superview W3

3D Optical Surface Profilometer
White Light Interferometry | Nano 3D Surface Form & Roughness
W3

Description Key Features Software: XtremeVision 3D Application Applications Cases Lens Spec General Spec Videos

SuperView W3 – 3D Optical Surface Profilometer

White Light Interferometry | Nano 3D Surface Form & Roughness

Large-scale microscopic 3D form and roughness

The CHOTEST SuperView W3 is a state-of-the-art optical surface profiler designed for high-precision 3D surface analysis at the nanometric level. Using white light interferometry, it provides accurate, repeatable, and non-contact measurements of surface form, roughness, and step height — ideal for R&D and quality control in semiconductor, optics, micro-electronics, and materials industries.


Key Features

Dedicated Functions for Semiconductor Field

  • Measure prof

  • Measure film step-height of wafer ranging from 1nm~1mm.

  • Measure roughness of silicon cut sheet after grinding process, and can measure

  • dozens of small areas to obtain the average value by one click.

  • Support 6", 8" and 12" wafer measurement, and easy switch between 3 sizes of vacuum chucks by one click automatically.

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Software: XtremeVision 3D

The integrated XtremeVision 3D software combines:

  • 3D image scanning & analysis

  • Automated measurement

  • Intelligent noise filtering

  • Hybrid scanning (white light interferometry + confocal)

It allows automatic feature recognition and step height measurement with repeatability as fine as 0.005μm and step accuracy of 0.08%.

The second-generation self-developed microscopic 3D measurement software integrates four modular functions: Image scanning, 3D analysis, Image measurement, and Automated measurement.

It can perfectly adapt to all microscopic 3D machine models of CHOTEST W series & VT series & WT series, and can independently identify the type of model. 
Especially, the software can automatically switch scanning modes between white light interferometry and confocal microscopy on 2-in-1 Hybrid 3D Optical Profilometer.

Application

It is used for measurement and analysis of surface roughness and profile of precision components
from industries of semi-conductor, 3C Electronics, ultraprecise machining, optical machining,

micro-nano materials, micro-electro-mechanical system.

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Application Cases

Measurement and analysis for various products, components and materials`surface form and profile characteristics, such as flatness, roughness, waviness, appearance, surface defect, abrasion, corrosion, gap,hole, stage, curvature, deformation, etc.

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Lens Specification



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Videos

3D Optical Surface Profilometer SuperView W3



Large-scale microscopic 3D form and shape: 

■ Large table ■ Applicable for 12" wafer ■ One-key automatic measurement Dedicated Functions for Semiconductor Field: • Measure profile trenches after laser grooving in the dicing process. • Measure film step-height of wafer ranging from 1nm~1mm. • Measure roughness of silicon cut sheet after grinding process, and can measure dozens of small areas to obtain the average value by one click. • Support 6", 8" and 12" wafer measurement, and easy switch between 3 sizes of vacuum chucks by one click automatically.

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For other models and more details, please refer to our brochure Request for brochure